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Diamond Powder×オプティカニクス - List of Manufacturers, Suppliers, Companies and Products

Diamond Powder Product List

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QPD/QPH Poly Micro Diamond Powder

QPD/QPH Poly Micro Diamond Powder

QPD and QPH are polycrystalline diamond powders, with QPD produced by an explosive method and QPH produced under high temperature and high pressure.

After special processing for refinement and modification, they exhibit excellent performance when processing semiconductor materials, advanced composite materials, optical glass, and other advanced materials without aggregation or surface deformation. Our polycrystalline diamond powder consists of uniform-sized, high-purity diamond particles achieved through advanced sorting and surface modification processes.

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QMM Mono Micro Diamond Powder

QMM Mono Micro Diamond Powder

This is a monomicro powder produced by high-pressure high-temperature synthesis, popular for cutting, lapping, and polishing various materials due to its hardness and crystal structure characteristics.

Monomicro diamond powder consists of uniformly sized, high-purity diamond particles achieved through advanced sorting and surface modification processes. Its relatively uniform shape allows for a high material removal rate when used in grinding applications. It is convenient for lapping and polishing in various applications such as quartz, ceramics, optics, semiconductors, and advanced composite materials.

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QMR Round Monomicro Diamond Powder

QMR Round Monomicro Diamond Powder

This is a round monomicro powder with a unique surface treatment. The spherical QMR synthetic diamond has a rough surface and high purity.

Due to the non-angular characteristics of diamonds, the cutting depth of the material during grinding becomes shallow, leading to high-precision processing. On the other hand, the numerous small cutting edges on the surface of the diamond improve cutting efficiency. Our round micro-diamond powder consists of uniformly sized, high-purity diamond particles achieved through advanced sorting and surface modification processes. Its relatively uniform shape allows for a high material removal rate when used in grinding applications. It is convenient for lapping and polishing in various applications such as quartz, ceramics, optics, semiconductors, and advanced composites.

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